3D IC Integrated Senior Expert
Huawei
- Louvain, Brabant Flamand
- CDI
- Temps-plein
- Output a competitive 3DIC engineering architecture according to the application scenarios and needs of the product.
- Decompose the engineering structure into implementable engineering plans, identify and perform 3DIC risk management, and finally transform the technology Idea into commercial success.
- Combined with the industry's best 3DIC engineering practice and industry analysis, carry out innovative research and industry-leading exchange of cutting-edge technology. Work with Vendor jointly to customize 3DIC technology suitable for HiSilicon, thus supporting HiSilicon to continuously be the lead in the 3DIC field.
- More than 10 years of work experience in related companies in the industry, technical team leader or senior expert.
- Having FAB work background, familiar with Wafer process, and has many successful 3DIC experience.
- The background and experience of Wafer Process Integration are required. And it’s best to have the experience covering any of the two items: 1) BEOL Process Integration; 2) Wafer Level Package Process Integration; 3) 2.5D Interposer/3DIC process integration including TSV Process, Chip to Wafer Process, wafer to wafer process, etc.
- Good teamwork ability, good communication skills. Excellent analytical skills.